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Your cart is empty.Substrates: Excellent choice for Integrated Circuits, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic and G-10 epoxy glass boards. Catalyst: Anhydride Hardness, Shore D: 83 Typical Applications: microwave EMI & RFI shielding, in the assembly or repair of printed circuit boards, wave-guides, electronic modules, flat cable, static shielding, connections, and circuitry. Viscosity @ 25 C cps: 6,800 Density gm/cc: 2.35 Silver , %: 70-72 Shelf life: 6 Months Operating Temperature: -45C to 170C Pot Life @ 25 C: 6 months @ 25C9 months refrigerated 60 min: @ 120C, 248F 30 mins: @ 150C, 302F 10 mins: @ 175C, 347F Sheet Resistivity: 10-12 m/sq Bulk Resistivity: 3x10-5/cm Adhesion Tensile Strength: 1000 N/cm2 (1500 lb/in2) Lap shear Strength: 1400 N/cm2 (2000 lb/in2) Thermal Conductivity: 0.04J/(cm.s. C):[0.01cal/(cm.s. C)] Specific heat: 0.30J/(g. C) :[0.07 cal/g. C] Coefficient of Thermal Expansion: 3x10-5 (m/m)/ C Modulus of elasticity:: 4x10+10(4*10 power of +10) Pa (6x105lb/in2) Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive is a single component epoxy, formulated with pure silver powder combined with organic binders and solvents to produce electrically conductive paths, films or patterns over non-conductive substrates.Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive shows slight settling when stored for a long period of time, no caking and will re disperse to a smooth homogeneous state.Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive formulation produces electrically conductive paths on a wide variety of surfaces including plastics, rubber, cloth, thermoplastic, paper, wood and many others.Silver-Bond AD1 Low Cost, One Part Heat Dry Electrically Conductive, Silver Epoxy Adhesive designed for use in diversified applications as microwave EMI & RFI shielding, in the assemb
